PTM7950, a proprietary material, offers exceptional reliability with 1000 hours of baking at 150 Degree Celsius and 1000 cycles of T/C-B testing. Its low thermal resistance makes it perfect for high-performance integrated circuits.
Featuring ultra-high thermal conductivity phase change material (PCM) in pad and sheet forms, this product minimizes interface thermal resistance. The novel polymeric PCM system ensures excellent interfacial wetting and low surface contact resistance, ideal for modern high-performance laptops.
Crafted from high-quality silicone, this compact and lightweight thermal pad is easy to carry and store. Its soft yet durable construction, smooth surface, and reliable sealing properties effectively reduce liquid leakage during use, ensuring long-lasting performance even when refrigerated.
Optimal performance is achieved by applying clamping pressure and temperature to attain a bond line thickness below 1.5 mil (0.038 mm). The material undergoes a phase transition temperature to unlock its full potential.
Specifically designed for CPUs, GPUs, power supplies, computer hosts, laptops, and various cooling modules, this cooling pad efficiently dissipates heat to prevent overheating in laptops and computers alike.
Description:
Introducing the thermal pad, a reliable and advanced thermal solution for high-performance integrated circuit devices. The PTM7950 series features a proprietary material known for its exceptional reliability, withstanding rigorous testing conditions such as 1000 hours of baking at 150 Degree Celsius and 1000 cycles of T/C-B. This material maintains low thermal resistance, ensuring optimal performance.
Utilizing ultra-high thermal conductivity phase change material (PCM) in pad and phase change sheet forms, the Thermal Pad is designed to minimize interface thermal resistance and deliver consistent performance. The novel polymeric PCM system enhances interfacial wetting across various temperatures, resulting in minimal surface contact resistance ideal for modern laptops.
Crafted from high-quality silicone material, the compact and lightweight thermal pad offers portability and durability. Its smooth surface and excellent sealing properties prevent liquid leakage during use, enabling long-term refrigerated storage. To maximize performance, apply clamping pressure and temperature to achieve a minimum bond line thickness below 1.5 mil (0.038 mm).
The thermal pad is versatile, suitable for cooling CPUs, GPUs, power supplies, computer hosts, laptops, and other cooling modules. Keep your devices running efficiently by dissipating heat effectively with this innovative cooling solution.
Item Name: Thermal Pad
Material: Silicone
Thickness: 0.25mm
Density: 2.8 (g/cm3)
Thermal Conductivity: 8.5W/m-k
Thermal Resistance: 0.04 Degree Celsius-cm2/W
Phase Change Temperature: Within 45 Degree Celsius
Features: Practical, Easy to Use, Reliable
Size Details:
80x80mm, L: 8cm, W: 8cm (Approx.)
160x80mm, L: 16cm, W: 8cm (Approx.)
Notes:
Due to the light and screen setting difference, the item's color may be slightly different from the pictures.
Please allow slight dimension difference due to different manual measurement.
Package Includes:
1 x Thermal Pad
