High Thermal Conductivity Silicone Gap Filler Heat Sink Pad

This product is a versatile and efficient thermal management solution designed to enhance heat dissipation in electronic devices. It is composed of silicone material that offers high thermal conductivity, ensuring effective heat transfer between components. The pad is flexible and easily conformable, making it ideal for filling gaps and uneven surfaces between heat-generating parts and heat sinks. Its reliable performance helps to prevent overheating, thereby improving device reliability and longevity. Suitable for a wide range of applications, this pad is perfect for use in computers, LED lighting, automotive electronics, and other heat-sensitive installations. Material: Silica gel Temperature resistance: -50-200 Manufacture country: China Instructions included: No